접착과학 및 바이오복합재료 연구실

Research Lab Activities

Lab Activities

  • Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference

  • 일시 October 22, 2014 ~ October 24, 2014
  • 참가자 Hyun-Joong Kim, Seung-Woo Lee
  • 장소 University of Tokyo, Japan
  • 상세내용 Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference에 참여하여 아래와 같이 발표하였음.

    이승수 박사수료 - (Poster)
    Polymer Syntheis and Properties of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process

    Polymer Testing of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process

    Design and Characterizations of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process