접착과학 및 바이오복합재료 연구실

International Conference

Total Results : 451

  • 291. Analysis of the Curing Behavior and Adhesion Properties of Thermal/UV Dual-curing System for Optically Clear Adhesives
    Tae-Hyung Lee Ji-Won Park Dong-Hyuk Lim Dou peng Hyun-Joong Kim Seung-Han Shin
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 290. Evaluation of Shrinkage at UV Curing Process by Comparing Between Numerical Approach and Experimental Methods
    Ji-Won Park Jong-Gyu Lee Young-Min Yoo Hyun-Joong Kim Seung-Han Shin
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 289. Study on adhesion properties of hot-melt pressure adhesive based on epoxidized styrene-isoprene-styrene(ESIS) copolymer for transdermal drug delivery systems(TDDS)
    Peng Dou Jue Cheng Junying Zhang Hyun-Joong Kim
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 288. Fabrication of Hybrid Optically Clear Adhesives with UV Cationic Curing for Improving Properties and Black Matrix Curing
    Ji-Won Park Young-Min Yoo Dong-Hyuk Lim Hyun-Joong Kim Seung-Han Shin
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 287. Fabrication of High Performance Bio-Composite based Bacterial Cellulose with Conducting Polymer
    Yeong-Min Yoo Hyun-Joong Kim Sera Jeon Ji-Won Park
    2013 Mini-Symposium on Green Composite (November 15, 2013 ~ November 15, 2013 / 2013 Mini-Symposium on Green Composite)
    Seoul, South Korea
  • 286. EVA/Intumescent Agent Flame Retardant Composite
    Hoon Kim Ji-Won Park Jung-Hun Lee Hyun-Joong Kim
    2013 Mini-Symposium on Green Composite (November 15, 2013 ~ November 15, 2013 / 2013 Mini-Symposium on Green Composite)
    Seoul, South Korea
  • 285. Predication and Calculation of Properties of the Bio-Composite
    Jong-Gyu Lee Hyuk-Jin Kwon Ji-Won Park Hyun-Joong Kim
    2013 Mini-Symposium on Green Composite (November 15, 2013 ~ November 15, 2013 / 2013 Mini-Symposium on Green Composite)
    Seoul, South Korea
  • 284. Bio-Composite of Kenaf Fibers in PLA for Automotive Interior Parts
    Tae-Hyung Lee Ji-Won Park Byung-Ho Lee Hyun-Joong Kim
    2013 Mini-Symposium on Green Composite (November 15, 2013 ~ November 15, 2013 / 2013 Mini-Symposium on Green Composite)
    Seoul, South Korea
  • 283. Research Trend of Bio-Composite
    Hyun-Joong Kim
    2013 Mini-Symposium on Green Composite (November 15, 2013 ~ November 15, 2013 / 2013 Mini-Symposium on Green Composite)
    Seoul, South Korea
  • 282. Electrical Conductive and Opitical Transparancy of Bacterial Cellulose Based Composite in Different Cultivation Methods
    Yeong-Min Yoo Sera Jeon Ji-Won Park Hyun-Joong Kim
    8th Pacific Regional Wood Anatomy and Annual Meeting of International Academy of Wood Science 2013 (October 17, 2013 ~ October 21, 2013 / 8th Pacific Regional Wood Anatomy and Annual Meeting of International Academy of Wood Science 2013)
    Nanjing, China
  • 281. Fabrication and Evaluation of Composite based Bacterial Cellulose with Ionic Conducting Polymer
    Yeong-Min Yoo Sera Jeon Ji-Won Park Hyun-Joong Kim
    8th Pacific Regional Wood Anatomy and Annual Meeting of International Academy of Wood Science 2013 (October 17, 2013 ~ October 21, 2013 / 8th Pacific Regional Wood Anatomy and Annual Meeting of International Academy of Wood Science 2013)
    Nanjing, China
  • 280. Fabrication and Characterization of Bacterial Cellulose based Nanocomposite and Its Applications
    Hyun-Joong Kim Hyeok-Jin Gwon Sera Jeon
    The 4th international Conference on Biobased Polymers (September 25, 2013 ~ September 28, 2013 / The 4th international Conference on Biobased Polymers)
    Hanyang University, South Korea
  • 279. Silane Treatment of Biocomposite to Improve Interfacial Adhesion and Thermal Stability
    Sera Jeon Ji-Won Park Hyun-Joong Kim
    The 4th international Conference on Biobased Polymers (September 25, 2013 ~ September 28, 2013 / The 4th international Conference on Biobased Polymers)
    Hanyang University, South Korea
  • 278. Evaluation and Prediction of Property of Bio/Nano-Composites
    Ji-Won Park Sera Jeon Jeong-Hun Lee Hyeok-Jin Gwon Hyun-Joong Kim
    The 4th international Conference on Biobased Polymers (September 25, 2013 ~ September 28, 2013 / The 4th international Conference on Biobased Polymers)
    Hanyang University, South Korea
  • 277. Adhesion Performance and Curing Behaviors of Dual Curable Urethane Acrylic Adhesives for Temporary Bonding in 3D Multi-chip Package Process
    Seung-Woo Lee Cho-Hee Park Ji-Won Park Dong-Hyuk Lim
    2013 Beijing International Bonding Technology Symposium and 5th Asian Conference on Adhesion (September 15, 2013 ~ September 17, 2013 / 2013 Beijing International Bonding Technology Symposium and 5th Asian Conference on Adhesion)
    Beijing, China
  • 276. Evaluation of UV Curing Behavior of UV Curable Resin through a Variety of Devices
    Ji-Won Park Jong-Gyu Lee Seung-Woo Lee Cho-Hee Park Hyun-Joong Kim Jin Ku Cho Seung-Han Shin
    2013 Beijing International Bonding Technology Symposium and 5th Asian Conference on Adhesion (September 15, 2013 ~ September 17, 2013 / 2013 Beijing International Bonding Technology Symposium and 5th Asian Conference on Adhesion)
    Beijing, China
  • 275. Curing Behavior and Thermal Property of Adhesive Based on Epoxy and Acrylic Functionalities
    Cho-Hee Park Seung-Woo Lee Ji-Won Park Hyun-Joong Kim
    2013 Beijing International Bonding Technology Symposium and 5th Asian Conference on Adhesion (September 15, 2013 ~ September 17, 2013 / 2013 Beijing International Bonding Technology Symposium and 5th Asian Conference on Adhesion)
    Beijing, China
  • 274. Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
    Seung-Woo Lee Cho-Hee Park Ji-Won Park Hyun-Joong Kim Dong-Hyuk Lim Jun-Yeob Song Jae-Hak Lee Hyoung-Jun Kim
    2nd International Workshop on Advanced Packaging & System Technology (September 03, 2013 ~ September 05, 2013 / 2nd International Workshop on Advanced Packaging & System Technology)
    Kitami Institute of Technology, Japan
  • 273. Improvement of Thermal Stability of Photo-cured Pressure Sensitive Adhesive by Multi-functional Crosslinker and Filler
    Hyung-Il Kim Myeongrang Kang Chong-Min Ryu Jin-Xin Hyun-Joong Kim
    2nd International Workshop on Advanced Packaging & System Technology (September 03, 2013 ~ September 05, 2013 / 2nd International Workshop on Advanced Packaging & System Technology)
    Kitami Institute of Technology, Japan
  • 272. Adhesive Modification for Temporary Wafer Bonding
    Cho-Hee Park Seung-Woo Lee Ji-Won Park Hyun-Joong Kim Dong-Hyuk Lim Jun-Yeob Song Jae-Hak Lee
    2nd International Workshop on Advanced Packaging & System Technology (September 03, 2013 ~ September 05, 2013 / 2nd International Workshop on Advanced Packaging & System Technology)
    Kitami Institute of Technology, Japan