접착과학 및 바이오복합재료 연구실

Total Results : 4

• 4. PosterUV-curable Pressure-sensitive Adhesive for Dicing Semiconductor Wafer
  Hyun-Sung Do Sung-Eun Kim Hyo-Sook Joo Hyun-Joong Kim
  2002 Fall Meeting of the Society of Adhesion and Interface, Korea (November 22, 2002 ~ November 22, 2002 / The Society of Adhesion and Interface, Korea)
  Korean Agency for Technology and Standards, Gwache, South Korea
• 3. PosterFormaldehyde Emission from Rice Husk Flour-Wood Particleboard by Perforator Method
  Young-Kyu Lee Hyun-Joong Kim
  2002 Fall Meeting of the Society of Adhesion and Interface, Korea (November 22, 2002 ~ November 22, 2002 / The Society of Adhesion and Interface, Korea)
  Korean Agency for Technology and Standards, Gwache, South Korea
• 2. PosterEffect of Softening Point of Tackifier Resin on EVA-based Hot-melt Adhesives
  Young-Jun Park Hyun-Joong Kim
  2002 Fall Meeting of the Society of Adhesion and Interface, Korea (November 22, 2002 ~ November 22, 2002 / The Society of Adhesion and Interface, Korea)
  Korean Agency for Technology and Standards, Gwache, South Korea
• 1. PosterRole of Formaldehyde Hardeners to Cross-linking of Condensed Tannin-based Adhesives
  Su-Min Kim Hyun-Joong Kim
  2002 Fall Meeting of the Society of Adhesion and Interface, Korea (November 22, 2002 ~ November 22, 2002 / The Society of Adhesion and Interface, Korea)
  Korean Agency for Technology and Standards, Gwache, South Korea