접착과학 및 바이오복합재료 연구실

International Conference

5th World Congress on Adhesion and Related Phenomena
  • September 07, 2014 ~ September 11, 2014
  • Nara Prefectural New Public Hall, Japan
  • 5th World Congress on Adhesion and Related Phenomena

Total Results : 10

  • 10. Design and Characterization of Temporary Bonding and Debonding Adhesives for 3D Multichip Packaging Process
    Seung-Woo Lee Tae-Hyung Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 9. Preparation of Cloud Point Resistant-adhesive and its Performance for Touch Screen Panel
    Hyun-Joong Kim Cho-Hee Park
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 8. Synthesis and adhesion performance of acrylic polymer/organoclay nanocomposite PSAs by in-situ photoinitiated polymerization
    Hoon Kim Ji-Won Park Cho-Hee Park Hyun-Joong Kim Seung-Han Shin
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 7. Thermal Properties of Acrylic Pressure Sensitive Adhesives with Micro-encapsulated Phase Change Material(PCM) and Single Wall Carbon Nanotubes(SWCNT)
    Seong-Ju Lee Ji-Won Park Seung-Woo Lee Hyun-Joong Kim Seung-Han Shin
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 6. The role of the adhesive to overcome the bottleneck in the electrical and electronic convergence industry [Invited Speaker]
    Hyun-Joong Kim
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 5. Research on Conductivity Change of Electrical Conductive Adhesives depends on Shrinkage
    Jong-Gyu Lee Ji-Won Park Peng Dou Hyun-Joong Kim Seung-Han Shin
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 4. Analysis of the Curing Behavior and Adhesion Properties of Thermal/UV Dual-curing System for Optically Clear Adhesives
    Tae-Hyung Lee Ji-Won Park Dong-Hyuk Lim Dou peng Hyun-Joong Kim Seung-Han Shin
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 3. Evaluation of Shrinkage at UV Curing Process by Comparing Between Numerical Approach and Experimental Methods
    Ji-Won Park Jong-Gyu Lee Young-Min Yoo Hyun-Joong Kim Seung-Han Shin
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 2. Study on adhesion properties of hot-melt pressure adhesive based on epoxidized styrene-isoprene-styrene(ESIS) copolymer for transdermal drug delivery systems(TDDS)
    Peng Dou Jue Cheng Junying Zhang Hyun-Joong Kim
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 1. Fabrication of Hybrid Optically Clear Adhesives with UV Cationic Curing for Improving Properties and Black Matrix Curing
    Ji-Won Park Young-Min Yoo Dong-Hyuk Lim Hyun-Joong Kim Seung-Han Shin
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan