- 
				
		10.
		Design and Characterization of Temporary Bonding and Debonding Adhesives for 3D Multichip Packaging Process
		
				
			
							Seung-Woo Lee											Tae-Hyung Lee											Ji-Won Park											Cho-Hee Park											Hyun-Joong Kim									 
			Nara Prefectural New Public Hall, Japan		 
- 
				
		9.
		Preparation of Cloud Point Resistant-adhesive and its Performance for Touch Screen Panel
		
				
			
							Hyun-Joong Kim											Cho-Hee Park									 
			Nara Prefectural New Public Hall, Japan		 
- 
				
		8.
		Synthesis and adhesion performance of acrylic polymer/organoclay nanocomposite PSAs by in-situ photoinitiated polymerization
		
				
			
							Hoon Kim											Ji-Won Park											Cho-Hee Park											Hyun-Joong Kim											Seung-Han Shin									 
			Nara Prefectural New Public Hall, Japan		 
- 
				
		7.
		Thermal Properties of Acrylic Pressure Sensitive Adhesives with Micro-encapsulated Phase Change Material(PCM) and Single Wall Carbon Nanotubes(SWCNT)
		
				
			
							Seong-Ju Lee											Ji-Won Park											Seung-Woo Lee											Hyun-Joong Kim											Seung-Han Shin									 
			Nara Prefectural New Public Hall, Japan		 
- 
				
		6.
		The role of the adhesive to overcome the bottleneck in the electrical and electronic convergence industry [Invited Speaker]
		
				
			
							Hyun-Joong Kim									 
			Nara Prefectural New Public Hall, Japan		 
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		5.
		Research on Conductivity Change of Electrical Conductive Adhesives depends on Shrinkage
		
				
			
							Jong-Gyu Lee											Ji-Won Park											Peng Dou											Hyun-Joong Kim											Seung-Han Shin									 
			Nara Prefectural New Public Hall, Japan		 
- 
				
		4.
		Analysis of the Curing Behavior and Adhesion Properties of Thermal/UV Dual-curing System for Optically Clear Adhesives
		
				
			
							Tae-Hyung Lee											Ji-Won Park											Dong-Hyuk Lim											Dou peng											Hyun-Joong Kim											Seung-Han Shin									 
			Nara Prefectural New Public Hall, Japan		 
- 
				
		3.
		Evaluation of Shrinkage at UV Curing Process by Comparing Between Numerical Approach and Experimental Methods
		
				
			
							Ji-Won Park											Jong-Gyu Lee											Young-Min Yoo											Hyun-Joong Kim											Seung-Han Shin									 
			Nara Prefectural New Public Hall, Japan		 
- 
				
		2.
		Study on adhesion properties of hot-melt pressure adhesive based on epoxidized styrene-isoprene-styrene(ESIS) copolymer for transdermal drug delivery systems(TDDS)
		
				
			
							Peng Dou											Jue Cheng											Junying Zhang											Hyun-Joong Kim									 
			Nara Prefectural New Public Hall, Japan		 
- 
				
		1.
		Fabrication of Hybrid Optically Clear Adhesives with UV Cationic Curing for Improving Properties and Black Matrix Curing
		
				
			
							Ji-Won Park											Young-Min Yoo											Dong-Hyuk Lim											Hyun-Joong Kim											Seung-Han Shin									 
			Nara Prefectural New Public Hall, Japan