접착과학 및 바이오복합재료 연구실

International Conference

Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference
  • October 22, 2014 ~ October 24, 2014
  • University of Tokyo, Japan
  • Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference

Total Results : 3

  • 3. Polymer Syntheis and Properties of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
    Seung-Woo Lee Tae-Hyung-Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Seung-Man Kim Jae-Hak Lee Jun-Yeob Song
    Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference (October 22, 2014 ~ October 24, 2014 / Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference)
    University of Tokyo, Japan
  • 2. Polymer Testing of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
    Seung-Woo Lee Tae-Hyung Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Sung-Hun Lee Seung-Man Kim Jae-Hak Lee
    Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference (October 22, 2014 ~ October 24, 2014 / Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference)
    University of Tokyo, Japan
  • 1. Design and Characterizations of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
    Seung-Woo Lee Tae-Hyung Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Sung-Hun Lee Seung-Man Kim Jae-Hak Lee
    Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference (October 22, 2014 ~ October 24, 2014 / Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference)
    University of Tokyo, Japan