접착과학 및 바이오복합재료 연구실

International Conference

The 3rd Japan-Korea Joint Friendship Conference
  • March 17, 2015 ~ March 19, 2015
  • Fukushima University, Japan
  • The 3rd Japan-Korea Joint Friendship Conference

Total Results : 1

  • 1. Temporary Bonding and UV Laser Debondable Adhesives for 3D Multi-chip Packaging Process [Invited Speaker]
    Hyun-Joong Kim
    The 3rd Japan-Korea Joint Friendship Conference (March 17, 2015 ~ March 19, 2015 / The 3rd Japan-Korea Joint Friendship Conference)
    Fukushima University, Japan