- 
				
		22.
		Fabrication of High Performance Bio-Composite based Bacterial Cellulose with Conducting Polymer
		
				
			
							Yeong-Min Yoo											Hyun-Joong Kim											Sera Jeon											Ji-Won Park									 
			Seoul, South Korea		 
- 
				
		21.
		EVA/Intumescent Agent Flame Retardant Composite
		
				
			
							Hoon Kim											Ji-Won Park											Jung-Hun Lee											Hyun-Joong Kim									 
			Seoul, South Korea		 
- 
				
		20.
		Predication and Calculation of Properties of the Bio-Composite
		
				
			
							Jong-Gyu Lee											Hyuk-Jin Kwon											Ji-Won Park											Hyun-Joong Kim									 
			Seoul, South Korea		 
- 
				
		19.
		Bio-Composite of Kenaf Fibers in PLA for Automotive Interior Parts
		
				
			
							Tae-Hyung Lee											Ji-Won Park											Byung-Ho Lee											Hyun-Joong Kim									 
			Seoul, South Korea		 
- 
				
		18.
		Research Trend of Bio-Composite
		
				
			
							Hyun-Joong Kim									 
			Seoul, South Korea		 
- 
				
		17.
		Electrical Conductive and Opitical Transparancy of Bacterial Cellulose Based Composite in Different Cultivation Methods
		
				
			
							Yeong-Min Yoo											Sera Jeon											Ji-Won Park											Hyun-Joong Kim									 
			Nanjing, China		 
- 
				
		16.
		Fabrication and Evaluation of Composite based Bacterial Cellulose with Ionic Conducting Polymer
		
				
			
							Yeong-Min Yoo											Sera Jeon											Ji-Won Park											Hyun-Joong Kim									 
			Nanjing, China		 
- 
				
		15.
		Fabrication and Characterization of Bacterial Cellulose based Nanocomposite and Its Applications
		
				
			
							Hyun-Joong Kim											Hyeok-Jin Gwon											Sera Jeon									 
			Hanyang University, South Korea		 
- 
				
		14.
		Silane Treatment of Biocomposite to Improve Interfacial Adhesion and Thermal Stability
		
				
			
							Sera Jeon											Ji-Won Park											Hyun-Joong Kim									 
			Hanyang University, South Korea		 
- 
				
		13.
		Evaluation and Prediction of Property of Bio/Nano-Composites
		
				
			
							Ji-Won Park											Sera Jeon											Jeong-Hun Lee											Hyeok-Jin Gwon											Hyun-Joong Kim									 
			Hanyang University, South Korea		 
- 
				
		12.
		Adhesion Performance and Curing Behaviors of Dual Curable Urethane Acrylic Adhesives for Temporary Bonding in 3D Multi-chip Package Process
		
				
			
							Seung-Woo Lee											Cho-Hee Park											Ji-Won Park											Dong-Hyuk Lim									 
			Beijing, China		 
- 
				
		11.
		Evaluation of UV Curing Behavior of UV Curable Resin through a Variety of Devices
		
				
			
							Ji-Won Park											Jong-Gyu Lee											Seung-Woo Lee											Cho-Hee Park											Hyun-Joong Kim											Jin Ku Cho											Seung-Han Shin									 
			Beijing, China		 
- 
				
		10.
		Curing Behavior and Thermal Property of Adhesive Based on Epoxy and Acrylic Functionalities
		
				
			
							Cho-Hee Park											Seung-Woo Lee											Ji-Won Park											Hyun-Joong Kim									 
			Beijing, China		 
- 
				
		9.
		Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
		
				
			
							Seung-Woo Lee											Cho-Hee Park											Ji-Won Park											Hyun-Joong Kim											Dong-Hyuk Lim											Jun-Yeob Song											Jae-Hak Lee											Hyoung-Jun Kim									 
			Kitami Institute of Technology, Japan		 
- 
				
		8.
		Improvement of Thermal Stability of Photo-cured Pressure Sensitive Adhesive by Multi-functional Crosslinker and Filler
		
				
			
							Hyung-Il Kim											Myeongrang Kang											Chong-Min Ryu											Jin-Xin											Hyun-Joong Kim									 
			Kitami Institute of Technology, Japan		 
- 
				
		7.
		Adhesive Modification for Temporary Wafer Bonding
		
				
			
							Cho-Hee Park											Seung-Woo Lee											Ji-Won Park											Hyun-Joong Kim											Dong-Hyuk Lim											Jun-Yeob Song											Jae-Hak Lee									 
			Kitami Institute of Technology, Japan		 
- 
				
		6.
		UV-curing Behavior and Thermal Property of Temporary Adhesives in MCP Process
		
				
			
							Seung-Woo Lee											Cho-Hee Park											Ji-Won Park											Hyun-Joong Kim											Dong-Hyuk Lim											Jun-Yeob Song											Jae-Hak Lee											Hyoung-Jun Kim									 
			Kitami Institute of Technology, Japan		 
- 
				
		5.
		Electrical and Optical Properties of Nanocellulose and Its Applications
		
				
			
							Hyun-Joong Kim									 
			Hawaii, United States of America		 
- 
				
		4.
		The Evaluation on UV Cring Behavior of UV curable Materials
		
				
			
							Ji-Won Park											Seung-Woo Lee											Cho-Hee Park											Hyun-Joong Kim											Jin-Ku Cho											Seung-Han Shin									 
			Meiji University, Japan		 
- 
				
		3.
		UV-curing and Thermal Properties of Dual Curable Urethane Epoxy Adhesives for Temporary Bonding in 3D Multi-Chip Package Process
		
				
			
							Seung-Woo Lee											Cho-Hee Park											Ji-Won Park											Hyun-Joong Kim											Jun-Yeob Song											Jae-Hak Lee									 
			Meiji University, Japan