접착과학 및 바이오복합재료 연구실

International Conference

Total Results : 393

  • 273. Improvement of Thermal Stability of Photo-cured Pressure Sensitive Adhesive by Multi-functional Crosslinker and Filler
    Hyung-Il Kim Myeongrang Kang Chong-Min Ryu Jin-Xin Hyun-Joong Kim
    2nd International Workshop on Advanced Packaging & System Technology (September 03, 2013 ~ September 05, 2013 / 2nd International Workshop on Advanced Packaging & System Technology)
    Kitami Institute of Technology, Japan
  • 272. Adhesive Modification for Temporary Wafer Bonding
    Cho-Hee Park Seung-Woo Lee Ji-Won Park Hyun-Joong Kim Dong-Hyuk Lim Jun-Yeob Song Jae-Hak Lee
    2nd International Workshop on Advanced Packaging & System Technology (September 03, 2013 ~ September 05, 2013 / 2nd International Workshop on Advanced Packaging & System Technology)
    Kitami Institute of Technology, Japan
  • 271. UV-curing Behavior and Thermal Property of Temporary Adhesives in MCP Process
    Seung-Woo Lee Cho-Hee Park Ji-Won Park Hyun-Joong Kim Dong-Hyuk Lim Jun-Yeob Song Jae-Hak Lee Hyoung-Jun Kim
    2nd International Workshop on Advanced Packaging & System Technology (September 03, 2013 ~ September 05, 2013 / 2nd International Workshop on Advanced Packaging & System Technology)
    Kitami Institute of Technology, Japan
  • 270. Electrical and Optical Properties of Nanocellulose and Its Applications
    Hyun-Joong Kim
    International Symposium on Green Manufacturing and Applications 2013 (June 25, 2013 ~ June 29, 2013 / International Symposium on Green Manufacturing and Applications 2013)
    Hawaii, United States of America
  • 269. The Evaluation on UV Cring Behavior of UV curable Materials
    Ji-Won Park Seung-Woo Lee Cho-Hee Park Hyun-Joong Kim Jin-Ku Cho Seung-Han Shin
    The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN (June 20, 2013 ~ June 21, 2013 / The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN)
    Meiji University, Japan
  • 268. UV-curing and Thermal Properties of Dual Curable Urethane Epoxy Adhesives for Temporary Bonding in 3D Multi-Chip Package Process
    Seung-Woo Lee Cho-Hee Park Ji-Won Park Hyun-Joong Kim Jun-Yeob Song Jae-Hak Lee
    The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN (June 20, 2013 ~ June 21, 2013 / The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN)
    Meiji University, Japan
  • 267. Modification and Characterization of Polyurethane for Temporary Wafer Bonding
    Cho-Hee Park Seung-Woo Lee Ji-Won Park Hyun-Joong Kim Jun-Yeob Song Jae-Hak Lee
    The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN (June 20, 2013 ~ June 21, 2013 / The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN)
    Meiji University, Japan
  • 266. UV-curing Behaviors and Themal Properties of Dual Curable Urethane Epoxy Adhesives For Tempopary Bonding in 3D Multi-Chip Package Process
    Seung-Woo Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim
    The 2013 Annual Meeting of the Adhesion Society (March 03, 2013 ~ March 06, 2013 / The 2013 Annual Meeting of the Adhesion Society)
    Florida, United States of America
  • 265. The Fabrication of Dual Curable Pressure-sensitive Adhesives for Temporary Bonding-debonding
    Seung-Woo Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Jun-Yeob Song Jae-Hak Lee Eon-Ah Kim
    9th European Adhesion Conference (September 16, 2012 ~ September 20, 2012 / 9th European Adhesion Conference)
    Friedrichshafen, Germany
  • 264. Preparation and Characterization of Adhesive for Though Silicone via- Multi Chip Packaging with Temporary Bonding-debonding Adhesive
    Cho-Hee Park Ji-Won Park Seung-Woo Lee Dong-Hyuck Lim Hyun-Joong Kim Jun-Yeob Song Jae-Hak Lee
    9th European Adhesion Conference (September 16, 2012 ~ September 20, 2012 / 9th European Adhesion Conference)
    Friedrichshafen, Germany
  • 263. The Fabrication of Optically Clear Pressure Sensitive Adhesives Using TiO2
    Seung-Woo Lee Ji-Won Park Young-Eun Kwon Hyun-Joong Kim
    35th Annual Meeting of The Adhesion Society (February 26, 2012 ~ February 29, 2012 / The Adhesion Society)
    New Orleans, United States of America
  • 262. Evaluation of Factor for Shrinkage in UV System
    Ji-Won Park Cho-Hee Park Jun-Ho Choi Hyun-Joong Kim
    35th Annual Meeting of The Adhesion Society (February 26, 2012 ~ February 29, 2012 / The Adhesion Society)
    New Orleans, United States of America
  • 261. Preparation and Characterization of Acid Free Acrylic Pressure Sensitive Adhesive with High Refractive Index for Optically Clear Adhesive
    Cho-Hee Park Ji-Won Park Eun-Suk Park Hyun-Joong Kim
    35th Annual Meeting of The Adhesion Society (February 26, 2012 ~ February 29, 2012 / The Adhesion Society)
    New Orleans, United States of America
  • 260. Sustainable Bio-based Green-composite with Natural Fiber
    Hyun-Joong Kim
    The 6th International Conference on Starch Technology (December 13, 2012 ~ December 14, 2012 / The 6th International Conference on Starch Technology)
    Bangkok, Thailand
  • 259. Activation Energy and Curing Behavior of Phenolic Adhesives by Thermal Analyzers
    Young-Kyu Lee Hyun-Joong Kim
    The abstract of the Society of Adhesion & Interface, Korea (SAIK) (February 13, 2011 ~ February 15, 2011 / The Society of Adhesion & Interface, Korea)
    Chungnam National University, Daejeon, South Korea
  • 258. Evaluation of Shrinkage and Analysis of Factors of Shrinkage
    Ji-Won Park Hyun-Woo Chung Seung-Woo Lee Cho-Hee Park Hyun-Joong Kim
    The 4th Asian Conference on Adhesion (September 25, 2011 ~ September 27, 2011 / Asian Conference on Adhesion)
    Busan, South Korea
  • 257. Synthesis and Properties of Acid-free Acrylic Pressure Sensitive Adhesive with High Refractive Index
    Cho-Hee Park Ji-Won Park Hyun-Joong Kim
    The 4th Asian Conference on Adhesion (September 25, 2011 ~ September 27, 2011 / Asian Conference on Adhesion)
    Busan, South Korea
  • 256. Adhesion Property and UV-curing Behavior of Si-modified Acrylic Pressure Sensitive Adhesives
    Young-Eun Kwon Seung-Woo Lee Won-Bum Jang Ji-Won Park Hyun-Joong Kim
    The 4th Asian Conference on Adhesion (September 25, 2011 ~ September 27, 2011 / Asian Conference on Adhesion)
    Busan, South Korea
  • 255. The Patterned PSA film for Releasing Air Bubble
    Eun-Suk Park Cho-Hee Park Ji-Won Park Hyun-Joong Kim
    The 4th Asian Conference on Adhesion (September 25, 2011 ~ September 27, 2011 / Asian Conference on Adhesion)
    Busan, South Korea
  • 254. Adhesion Performance and Curing Behaviors of Acid-free Acrylic PSAs Using Metal Chelate
    Seung-Woo Lee Ji-Won Park Hyun-Joong Kim
    The 4th Asian Conference on Adhesion (September 25, 2011 ~ September 27, 2011 / Asian Conference on Adhesion)
    Busan, South Korea