접착과학 및 바이오복합재료 연구실

International Conference

Total Results : 380

  • 320. Aging Behavior Characterization of Optical Bonding Material for Touch Screen Panel
    Cho-Hee Park Seong-Ju Lee Tae-Hyung Lee Hyun-Joong Kim
    The 53rd Adhesion Society of Japan (June 19, 2015 ~ June 20, 2015 / The 53rd Adhesion Society of Japan)
    Aichi Institute of Technology, Japan
  • 319. Development of New Type of Optical Pressure-Sensitive Adhesive of Utilizing the Complex Curing System
    Ji-Won Park Tae-Hyung Lee Jong-Gyu Lee Hyun-Joong Kim
    The 53rd Adhesion Society of Japan (June 19, 2015 ~ June 20, 2015 / The 53rd Adhesion Society of Japan)
    Aichi Institute of Technology, Japan
  • 318. Improved Strength of the PLA utilizing Nano-Cellulose
    Tae-Hyung Lee Cho-Hee Park Hoon Kim Hyun-Joong Kim
    The 5th International Conference on Bio-based Polymers (June 24, 2015 ~ June 27, 2015 / The 5th International Conference on Bio-based Polymers)
    National University of Singapore, Singapore
  • 317. Composite Development of PLA/CCS based Polymer
    Ji-Won Park Seong-Ju Lee Gyu-Sung Shim Hyun-Joong Kim
    The 5th International Conference on Bio-based Polymers (June 24, 2015 ~ June 27, 2015 / The 5th International Conference on Bio-based Polymers)
    National University of Singapore, Singapore
  • 316. Manufacture and Evaluation of PLA based Bio-Screw
    Jung-Hun Lee Pan-Seok Kim Jong-Gyu Lee Hyun-Joong Kim
    The 5th International Conference on Bio-based Polymers (June 24, 2015 ~ June 27, 2015 / The 5th International Conference on Bio-based Polymers)
    National University of Singapore, Singapore
  • 315. Analysis of the Re-stacking Structure of Clay Dispersioned Intumescent Flame Retardant Composites
    Jung-Hun Lee Hoon Kim Ji-Won Park Hyun-Joong Kim Jung-Youn Choi
    International Nanotechnology Conference 2015 (April 22, 2015 ~ April 24, 2015 / International Nanotechnology Conference 2015)
    Tunisia, Tunisia
  • 314. Flame Retardant Nanocomposite Materials Utilizing Intumescent System and Nano Clay
    Hyun-Joong Kim Ji-Won Park Hoon Kim Jung-Hun Lee M-J Kwon J-Y Choi
    International Nanotechnology Conference 2015 (April 22, 2015 ~ April 24, 2015 / International Nanotechnology Conference 2015)
    Tunisia, Tunisia
  • 313. Manufacturing Polylactic Acid (PLA)/Nano Crystal Cellulose(NCC) by Solution Blending and Investigation of Improved Mechanical Properties
    Tae-Hyung Lee Sung-Ju Lee Ji-Won Park Hyun-Joong Kim
    International Nanotechnology Conference 2015 (April 22, 2015 ~ April 24, 2015 / International Nanotechnology Conference 2015)
    Tunisia, Tunisia
  • 312. Temporary Bonding and UV Laser Debondable Adhesives for 3D Multi-chip Packaging Process [Invited Speaker]
    Hyun-Joong Kim
    The 3rd Japan-Korea Joint Friendship Conference (March 17, 2015 ~ March 19, 2015 / The 3rd Japan-Korea Joint Friendship Conference)
    Fukushima University, Japan
  • 311. Hybrid Curable OCA for New Assembly Line of Touch Screen Panel
    Hyun-Joong Kim
    2015 Award for Excellence in Adhesion Society Symposium (February 20, 2015 ~ February 25, 2015 / 2015 Award for Excellence in Adhesion Society Symposium)
    Savannah, United States of America
  • 310. Synthesis and Evaluation of Hybrid Curing OCA Using UV Polymerization
    Hyun-Joong Kim Tae-Hyung Lee Sung-Ju Lee Ji-Won Park
    2015 Award for Excellence in Adhesion Society Symposium (February 20, 2015 ~ February 25, 2015 / 2015 Award for Excellence in Adhesion Society Symposium)
    Savannah, United States of America
  • 309. Evaluation of UV-Curing Kinetics of the UV Polymerized Adhesives with Poly(ethylene glycol) Dimethacrylate
    Ji-Won Park Hoon Kim Hyun-Joong Kim
    2015 Award for Excellence in Adhesion Society Symposium (February 20, 2015 ~ February 25, 2015 / 2015 Award for Excellence in Adhesion Society Symposium)
    Savannah, United States of America
  • 308. Understanding and Evaluation on the Linear Shrinkage of Photo-Curing Behavior through the Experimental Approach and Numerical Modeling
    Ji-Won Park Jong-Gyu Lee Hyun-Joong Kim
    2015 Award for Excellence in Adhesion Society Symposium (February 20, 2015 ~ February 25, 2015 / 2015 Award for Excellence in Adhesion Society Symposium)
    Savannah, United States of America
  • 307. The Role of the Adhesive to Overcome the Bottleneck in the Electrical and Electronic Convergence Industry [Invited Speaker]
    Hyun-Joong Kim
    Material & Mathematics (January 29, 2015 ~ January 31, 2015 / Material & Mathematics)
    Shanghai, China
  • 306. EVA/Intumescent Agent Flame Retardant Composite Materials using Organic/Inorganic Hybrid Filler
    Ji-Won Park Hoon Kim Hyun-Joong Kim
    International Conference on Construction Materials and Structures (ICCMATS 2014) (November 24, 2014 ~ November 26, 2014 / International Conference on Construction Materials and Structures (ICCMATS 2014))
    Johannesburg, South Africa
  • 305. Challenge of New OCA for the Next Generation Display [Invited Speaker]
    Hyun-Joong Kim
    The 5th Conference of Asia Regional Adhesive Council (ARAC 2014) (October 29, 2014 ~ October 31, 2014 / The 5th Conference of Asia Regional Adhesive Council (ARAC 2014))
    Kobe International Conference Center, Japan
  • 304. Polymer Syntheis and Properties of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
    Seung-Woo Lee Tae-Hyung-Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Seung-Man Kim Jae-Hak Lee Jun-Yeob Song
    Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference (October 22, 2014 ~ October 24, 2014 / Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference)
    University of Tokyo, Japan
  • 303. Polymer Testing of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
    Seung-Woo Lee Tae-Hyung Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Sung-Hun Lee Seung-Man Kim Jae-Hak Lee
    Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference (October 22, 2014 ~ October 24, 2014 / Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference)
    University of Tokyo, Japan
  • 302. Design and Characterizations of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
    Seung-Woo Lee Tae-Hyung Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Sung-Hun Lee Seung-Man Kim Jae-Hak Lee
    Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference (October 22, 2014 ~ October 24, 2014 / Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference)
    University of Tokyo, Japan
  • 301. Application and Development of Nano-Cellulose based Nano-Bio-Composites
    Hyun-Joong Kim
    The 22nd Annual Meeting of the Bio-Environmental Polymer Society (BEPS 2014) (October 14, 2014 ~ October 17, 2014 / The 22nd Annual Meeting of the Bio-Environmental Polymer Society (BEPS 2014))
    Kauffman Foundation Conference Center, United States of America