- 
				
		291.
		Analysis of the Curing Behavior and Adhesion Properties of Thermal/UV Dual-curing System for Optically Clear Adhesives
		
				
			
							Tae-Hyung Lee											Ji-Won Park											Dong-Hyuk Lim											Dou peng											Hyun-Joong Kim											Seung-Han Shin									 
			Nara Prefectural New Public Hall, Japan		 
- 
				
		290.
		Evaluation of Shrinkage at UV Curing Process by Comparing Between Numerical Approach and Experimental Methods
		
				
			
							Ji-Won Park											Jong-Gyu Lee											Young-Min Yoo											Hyun-Joong Kim											Seung-Han Shin									 
			Nara Prefectural New Public Hall, Japan		 
- 
				
		289.
		Study on adhesion properties of hot-melt pressure adhesive based on epoxidized styrene-isoprene-styrene(ESIS) copolymer for transdermal drug delivery systems(TDDS)
		
				
			
							Peng Dou											Jue Cheng											Junying Zhang											Hyun-Joong Kim									 
			Nara Prefectural New Public Hall, Japan		 
- 
				
		288.
		Fabrication of Hybrid Optically Clear Adhesives with UV Cationic Curing for Improving Properties and Black Matrix Curing
		
				
			
							Ji-Won Park											Young-Min Yoo											Dong-Hyuk Lim											Hyun-Joong Kim											Seung-Han Shin									 
			Nara Prefectural New Public Hall, Japan		 
- 
				
		287.
		Fabrication of High Performance Bio-Composite based Bacterial Cellulose with Conducting Polymer
		
				
			
							Yeong-Min Yoo											Hyun-Joong Kim											Sera Jeon											Ji-Won Park									 
			Seoul, South Korea		 
- 
				
		286.
		EVA/Intumescent Agent Flame Retardant Composite
		
				
			
							Hoon Kim											Ji-Won Park											Jung-Hun Lee											Hyun-Joong Kim									 
			Seoul, South Korea		 
- 
				
		285.
		Predication and Calculation of Properties of the Bio-Composite
		
				
			
							Jong-Gyu Lee											Hyuk-Jin Kwon											Ji-Won Park											Hyun-Joong Kim									 
			Seoul, South Korea		 
- 
				
		284.
		Bio-Composite of Kenaf Fibers in PLA for Automotive Interior Parts
		
				
			
							Tae-Hyung Lee											Ji-Won Park											Byung-Ho Lee											Hyun-Joong Kim									 
			Seoul, South Korea		 
- 
				
		283.
		Research Trend of Bio-Composite
		
				
			
							Hyun-Joong Kim									 
			Seoul, South Korea		 
- 
				
		282.
		Electrical Conductive and Opitical Transparancy of Bacterial Cellulose Based Composite in Different Cultivation Methods
		
				
			
							Yeong-Min Yoo											Sera Jeon											Ji-Won Park											Hyun-Joong Kim									 
			Nanjing, China		 
- 
				
		281.
		Fabrication and Evaluation of Composite based Bacterial Cellulose with Ionic Conducting Polymer
		
				
			
							Yeong-Min Yoo											Sera Jeon											Ji-Won Park											Hyun-Joong Kim									 
			Nanjing, China		 
- 
				
		280.
		Fabrication and Characterization of Bacterial Cellulose based Nanocomposite and Its Applications
		
				
			
							Hyun-Joong Kim											Hyeok-Jin Gwon											Sera Jeon									 
			Hanyang University, South Korea		 
- 
				
		279.
		Silane Treatment of Biocomposite to Improve Interfacial Adhesion and Thermal Stability
		
				
			
							Sera Jeon											Ji-Won Park											Hyun-Joong Kim									 
			Hanyang University, South Korea		 
- 
				
		278.
		Evaluation and Prediction of Property of Bio/Nano-Composites
		
				
			
							Ji-Won Park											Sera Jeon											Jeong-Hun Lee											Hyeok-Jin Gwon											Hyun-Joong Kim									 
			Hanyang University, South Korea		 
- 
				
		277.
		Adhesion Performance and Curing Behaviors of Dual Curable Urethane Acrylic Adhesives for Temporary Bonding in 3D Multi-chip Package Process
		
				
			
							Seung-Woo Lee											Cho-Hee Park											Ji-Won Park											Dong-Hyuk Lim									 
			Beijing, China		 
- 
				
		276.
		Evaluation of UV Curing Behavior of UV Curable Resin through a Variety of Devices
		
				
			
							Ji-Won Park											Jong-Gyu Lee											Seung-Woo Lee											Cho-Hee Park											Hyun-Joong Kim											Jin Ku Cho											Seung-Han Shin									 
			Beijing, China		 
- 
				
		275.
		Curing Behavior and Thermal Property of Adhesive Based on Epoxy and Acrylic Functionalities
		
				
			
							Cho-Hee Park											Seung-Woo Lee											Ji-Won Park											Hyun-Joong Kim									 
			Beijing, China		 
- 
				
		274.
		Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
		
				
			
							Seung-Woo Lee											Cho-Hee Park											Ji-Won Park											Hyun-Joong Kim											Dong-Hyuk Lim											Jun-Yeob Song											Jae-Hak Lee											Hyoung-Jun Kim									 
			Kitami Institute of Technology, Japan		 
- 
				
		273.
		Improvement of Thermal Stability of Photo-cured Pressure Sensitive Adhesive by Multi-functional Crosslinker and Filler
		
				
			
							Hyung-Il Kim											Myeongrang Kang											Chong-Min Ryu											Jin-Xin											Hyun-Joong Kim									 
			Kitami Institute of Technology, Japan		 
- 
				
		272.
		Adhesive Modification for Temporary Wafer Bonding
		
				
			
							Cho-Hee Park											Seung-Woo Lee											Ji-Won Park											Hyun-Joong Kim											Dong-Hyuk Lim											Jun-Yeob Song											Jae-Hak Lee									 
			Kitami Institute of Technology, Japan