접착과학 및 바이오복합재료 연구실

Publication International Conference

International Conference

Total Results : 448

  • 268. UV-curing and Thermal Properties of Dual Curable Urethane Epoxy Adhesives for Temporary Bonding in 3D Multi-Chip Package Process
    Seung-Woo Lee Cho-Hee Park Ji-Won Park Hyun-Joong Kim Jun-Yeob Song Jae-Hak Lee
    The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN (June 20, 2013 ~ June 21, 2013 / The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN)
    Meiji University, Japan
  • 267. Modification and Characterization of Polyurethane for Temporary Wafer Bonding
    Cho-Hee Park Seung-Woo Lee Ji-Won Park Hyun-Joong Kim Jun-Yeob Song Jae-Hak Lee
    The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN (June 20, 2013 ~ June 21, 2013 / The 51st Symposium on Adhesion - THE ADHESION SOCIETY OF JAPAN)
    Meiji University, Japan
  • 266. UV-curing Behaviors and Themal Properties of Dual Curable Urethane Epoxy Adhesives For Tempopary Bonding in 3D Multi-Chip Package Process
    Seung-Woo Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim
    The 2013 Annual Meeting of the Adhesion Society (March 03, 2013 ~ March 06, 2013 / The 2013 Annual Meeting of the Adhesion Society)
    Florida, United States of America
  • 265. The Fabrication of Dual Curable Pressure-sensitive Adhesives for Temporary Bonding-debonding
    Seung-Woo Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Jun-Yeob Song Jae-Hak Lee Eon-Ah Kim
    9th European Adhesion Conference (September 16, 2012 ~ September 20, 2012 / 9th European Adhesion Conference)
    Friedrichshafen, Germany
  • 264. Preparation and Characterization of Adhesive for Though Silicone via- Multi Chip Packaging with Temporary Bonding-debonding Adhesive
    Cho-Hee Park Ji-Won Park Seung-Woo Lee Dong-Hyuck Lim Hyun-Joong Kim Jun-Yeob Song Jae-Hak Lee
    9th European Adhesion Conference (September 16, 2012 ~ September 20, 2012 / 9th European Adhesion Conference)
    Friedrichshafen, Germany
  • 263. The Fabrication of Optically Clear Pressure Sensitive Adhesives Using TiO2
    Seung-Woo Lee Ji-Won Park Young-Eun Kwon Hyun-Joong Kim
    35th Annual Meeting of The Adhesion Society (February 26, 2012 ~ February 29, 2012 / The Adhesion Society)
    New Orleans, United States of America
  • 262. Evaluation of Factor for Shrinkage in UV System
    Ji-Won Park Cho-Hee Park Jun-Ho Choi Hyun-Joong Kim
    35th Annual Meeting of The Adhesion Society (February 26, 2012 ~ February 29, 2012 / The Adhesion Society)
    New Orleans, United States of America
  • 261. Preparation and Characterization of Acid Free Acrylic Pressure Sensitive Adhesive with High Refractive Index for Optically Clear Adhesive
    Cho-Hee Park Ji-Won Park Eun-Suk Park Hyun-Joong Kim
    35th Annual Meeting of The Adhesion Society (February 26, 2012 ~ February 29, 2012 / The Adhesion Society)
    New Orleans, United States of America
  • 260. Sustainable Bio-based Green-composite with Natural Fiber
    Hyun-Joong Kim
    The 6th International Conference on Starch Technology (December 13, 2012 ~ December 14, 2012 / The 6th International Conference on Starch Technology)
    Bangkok, Thailand
  • 259. Activation Energy and Curing Behavior of Phenolic Adhesives by Thermal Analyzers
    Young-Kyu Lee Hyun-Joong Kim
    The abstract of the Society of Adhesion & Interface, Korea (SAIK) (February 13, 2011 ~ February 15, 2011 / The Society of Adhesion & Interface, Korea)
    Chungnam National University, Daejeon, South Korea
  • 258. Evaluation of Shrinkage and Analysis of Factors of Shrinkage
    Ji-Won Park Hyun-Woo Chung Seung-Woo Lee Cho-Hee Park Hyun-Joong Kim
    The 4th Asian Conference on Adhesion (September 25, 2011 ~ September 27, 2011 / Asian Conference on Adhesion)
    Busan, South Korea
  • 257. Synthesis and Properties of Acid-free Acrylic Pressure Sensitive Adhesive with High Refractive Index
    Cho-Hee Park Ji-Won Park Hyun-Joong Kim
    The 4th Asian Conference on Adhesion (September 25, 2011 ~ September 27, 2011 / Asian Conference on Adhesion)
    Busan, South Korea
  • 256. Adhesion Property and UV-curing Behavior of Si-modified Acrylic Pressure Sensitive Adhesives
    Young-Eun Kwon Seung-Woo Lee Won-Bum Jang Ji-Won Park Hyun-Joong Kim
    The 4th Asian Conference on Adhesion (September 25, 2011 ~ September 27, 2011 / Asian Conference on Adhesion)
    Busan, South Korea
  • 255. The Patterned PSA film for Releasing Air Bubble
    Eun-Suk Park Cho-Hee Park Ji-Won Park Hyun-Joong Kim
    The 4th Asian Conference on Adhesion (September 25, 2011 ~ September 27, 2011 / Asian Conference on Adhesion)
    Busan, South Korea
  • 254. Adhesion Performance and Curing Behaviors of Acid-free Acrylic PSAs Using Metal Chelate
    Seung-Woo Lee Ji-Won Park Hyun-Joong Kim
    The 4th Asian Conference on Adhesion (September 25, 2011 ~ September 27, 2011 / Asian Conference on Adhesion)
    Busan, South Korea
  • 253. Nanocellulose/Conducting Polymer Nanocomposite Films based on Bacterial Cellulose
    Byoung-Ho Lee Hyun-Ji Lee Taek-Jun Chung Hyun-Joong Kim
    11th International Conference on Wood & Biofiber Plastic Composites (May 16, 2011 ~ May 18, 2011 / 11th International Conference on Wood & Biofiber Plastic Composites)
    Madison, Wisconsin, United States of America
  • 252. Synthesis of Polyester Resin and Polyester Coatings of Pre-coated Metal for Automotive
    Yong-Hee Lee Je-Ik Moon Cho-Hee Park Hyun-Joong Kim
    European Coating Congress 2011 (March 28, 2011 ~ March 30, 2011 / European Coating Congress)
    NurnbergMesse, Nurnberh, Germany
  • 251. High Flexibility and Formability of Linear Polyester Coatings for Automotive Clearcoat
    Je-Ik Moon Yong-Hee Lee Hyun-Joong Kim
    European Coating Congress 2011 (March 28, 2011 ~ March 30, 2011 / European Coating Congress)
    NurnbergMesse, Nurnberh, Germany
  • 250. Photopolymeric Acrylate Coatings Incorporating Fluorinated Material
    Cho-Hee Park Hyun-Deuk Hwang Yong-Hee Lee Je-Ik Moon Hyun-Joong Kim
    European Coating Congress 2011 (March 28, 2011 ~ March 30, 2011 / European Coating Congress)
    NurnbergMesse, Nurnberh, Germany
  • 249. PSA Performance at Low Temperature by Combinatorial Method Using a Temperature Gradient Surface
    Ji-Won Park Dong-Hyuk Lim Hyun-Joong Kim
    The 3rd Asian Conference on Adhesion (June 08, 2009 ~ June 08, 2009 / The 3rd Asian Conference on Adhesion)
    Hamamatsu, Japan