- 
				
		311.
		Hybrid Curable OCA for New Assembly Line of Touch Screen Panel
		
				
			
							Hyun-Joong Kim									 
			Savannah, United States of America		 
- 
				
		310.
		Synthesis and Evaluation of Hybrid Curing OCA Using UV Polymerization
		
				
			
							Hyun-Joong Kim											Tae-Hyung Lee											Sung-Ju Lee											Ji-Won Park									 
			Savannah, United States of America		 
- 
				
		309.
		Evaluation of UV-Curing Kinetics of the UV Polymerized Adhesives with Poly(ethylene glycol) Dimethacrylate
		
				
			
							Ji-Won Park											Hoon Kim											Hyun-Joong Kim									 
			Savannah, United States of America		 
- 
				
		308.
		Understanding and Evaluation on the Linear Shrinkage of Photo-Curing Behavior through the Experimental Approach and Numerical Modeling
		
				
			
							Ji-Won Park											Jong-Gyu Lee											Hyun-Joong Kim									 
			Savannah, United States of America		 
- 
				
		307.
		The Role of the Adhesive to Overcome the Bottleneck in the Electrical and Electronic Convergence Industry [Invited Speaker]
		
				
			
							Hyun-Joong Kim									 
			Shanghai, China		 
- 
				
		306.
		EVA/Intumescent Agent Flame Retardant Composite Materials using Organic/Inorganic Hybrid Filler
		
				
			
							Ji-Won Park											Hoon Kim											Hyun-Joong Kim									 
			Johannesburg, South Africa		 
- 
				
		305.
		Challenge of New OCA for the Next Generation Display [Invited Speaker]
		
				
			
							Hyun-Joong Kim									 
			Kobe International Conference Center, Japan		 
- 
				
		304.
		Polymer Syntheis and Properties of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
		
				
			
							Seung-Woo Lee											Tae-Hyung-Lee											Ji-Won Park											Cho-Hee Park											Hyun-Joong Kim											Seung-Man Kim											Jae-Hak Lee											Jun-Yeob Song									 
			University of Tokyo, Japan		 
- 
				
		303.
		Polymer Testing of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
		
				
			
							Seung-Woo Lee											Tae-Hyung Lee											Ji-Won Park											Cho-Hee Park											Hyun-Joong Kim											Sung-Hun Lee											Seung-Man Kim											Jae-Hak Lee									 
			University of Tokyo, Japan		 
- 
				
		302.
		Design and Characterizations of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
		
				
			
							Seung-Woo Lee											Tae-Hyung Lee											Ji-Won Park											Cho-Hee Park											Hyun-Joong Kim											Sung-Hun Lee											Seung-Man Kim											Jae-Hak Lee									 
			University of Tokyo, Japan		 
- 
				
		301.
		Application and Development of Nano-Cellulose based Nano-Bio-Composites
		
				
			
							Hyun-Joong Kim									 
			Kauffman Foundation Conference Center, United States of America		 
- 
				
		300.
		Research Trend of Nano-Composie & Bio-Composites [Invited Speaker]
		
				
			
							Hyun-Joong Kim									 
			Yamaguchi University, Japan		 
- 
				
		299.
		Non-Halogen System of Flame
		
				
			
							Ji-Won Park									 
			Yamaguchi University, Japan		 
- 
				
		298.
		New Biocomposites for Bioscrew in Bone Joint Desease
		
				
			
							Tae-Hyung Lee											Ji-Won Park											Hyun-Joong Kim									 
			Yamaguchi University, Japan		 
- 
				
		297.
		Design and Characterization of Temporary Bonding and Debonding Adhesives for 3D Multichip Packaging Process
		
				
			
							Seung-Woo Lee											Tae-Hyung Lee											Ji-Won Park											Cho-Hee Park											Hyun-Joong Kim									 
			Nara Prefectural New Public Hall, Japan		 
- 
				
		296.
		Preparation of Cloud Point Resistant-adhesive and its Performance for Touch Screen Panel
		
				
			
							Hyun-Joong Kim											Cho-Hee Park									 
			Nara Prefectural New Public Hall, Japan		 
- 
				
		295.
		Synthesis and adhesion performance of acrylic polymer/organoclay nanocomposite PSAs by in-situ photoinitiated polymerization
		
				
			
							Hoon Kim											Ji-Won Park											Cho-Hee Park											Hyun-Joong Kim											Seung-Han Shin									 
			Nara Prefectural New Public Hall, Japan		 
- 
				
		294.
		Thermal Properties of Acrylic Pressure Sensitive Adhesives with Micro-encapsulated Phase Change Material(PCM) and Single Wall Carbon Nanotubes(SWCNT)
		
				
			
							Seong-Ju Lee											Ji-Won Park											Seung-Woo Lee											Hyun-Joong Kim											Seung-Han Shin									 
			Nara Prefectural New Public Hall, Japan		 
- 
				
		293.
		The role of the adhesive to overcome the bottleneck in the electrical and electronic convergence industry [Invited Speaker]
		
				
			
							Hyun-Joong Kim									 
			Nara Prefectural New Public Hall, Japan		 
- 
				
		292.
		Research on Conductivity Change of Electrical Conductive Adhesives depends on Shrinkage
		
				
			
							Jong-Gyu Lee											Ji-Won Park											Peng Dou											Hyun-Joong Kim											Seung-Han Shin									 
			Nara Prefectural New Public Hall, Japan