-
318.
Improved Strength of the PLA utilizing Nano-Cellulose
Tae-Hyung Lee Cho-Hee Park Hoon Kim Hyun-Joong Kim
National University of Singapore, Singapore
-
317.
Composite Development of PLA/CCS based Polymer
Ji-Won Park Seong-Ju Lee Gyu-Sung Shim Hyun-Joong Kim
National University of Singapore, Singapore
-
316.
Manufacture and Evaluation of PLA based Bio-Screw
Jung-Hun Lee Pan-Seok Kim Jong-Gyu Lee Hyun-Joong Kim
National University of Singapore, Singapore
-
315.
Analysis of the Re-stacking Structure of Clay Dispersioned Intumescent Flame Retardant Composites
Jung-Hun Lee Hoon Kim Ji-Won Park Hyun-Joong Kim Jung-Youn Choi
Tunisia, Tunisia
-
314.
Flame Retardant Nanocomposite Materials Utilizing Intumescent System and Nano Clay
Hyun-Joong Kim Ji-Won Park Hoon Kim Jung-Hun Lee M-J Kwon J-Y Choi
Tunisia, Tunisia
-
313.
Manufacturing Polylactic Acid (PLA)/Nano Crystal Cellulose(NCC) by Solution Blending and Investigation of Improved Mechanical Properties
Tae-Hyung Lee Sung-Ju Lee Ji-Won Park Hyun-Joong Kim
Tunisia, Tunisia
-
312.
Temporary Bonding and UV Laser Debondable Adhesives for 3D Multi-chip Packaging Process [Invited Speaker]
Hyun-Joong Kim
Fukushima University, Japan
-
311.
Hybrid Curable OCA for New Assembly Line of Touch Screen Panel
Hyun-Joong Kim
Savannah, United States of America
-
310.
Synthesis and Evaluation of Hybrid Curing OCA Using UV Polymerization
Hyun-Joong Kim Tae-Hyung Lee Sung-Ju Lee Ji-Won Park
Savannah, United States of America
-
309.
Evaluation of UV-Curing Kinetics of the UV Polymerized Adhesives with Poly(ethylene glycol) Dimethacrylate
Ji-Won Park Hoon Kim Hyun-Joong Kim
Savannah, United States of America
-
308.
Understanding and Evaluation on the Linear Shrinkage of Photo-Curing Behavior through the Experimental Approach and Numerical Modeling
Ji-Won Park Jong-Gyu Lee Hyun-Joong Kim
Savannah, United States of America
-
307.
The Role of the Adhesive to Overcome the Bottleneck in the Electrical and Electronic Convergence Industry [Invited Speaker]
Hyun-Joong Kim
Shanghai, China
-
306.
EVA/Intumescent Agent Flame Retardant Composite Materials using Organic/Inorganic Hybrid Filler
Ji-Won Park Hoon Kim Hyun-Joong Kim
Johannesburg, South Africa
-
305.
Challenge of New OCA for the Next Generation Display [Invited Speaker]
Hyun-Joong Kim
Kobe International Conference Center, Japan
-
304.
Polymer Syntheis and Properties of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
Seung-Woo Lee Tae-Hyung-Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Seung-Man Kim Jae-Hak Lee Jun-Yeob Song
University of Tokyo, Japan
-
303.
Polymer Testing of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
Seung-Woo Lee Tae-Hyung Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Sung-Hun Lee Seung-Man Kim Jae-Hak Lee
University of Tokyo, Japan
-
302.
Design and Characterizations of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
Seung-Woo Lee Tae-Hyung Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Sung-Hun Lee Seung-Man Kim Jae-Hak Lee
University of Tokyo, Japan
-
301.
Application and Development of Nano-Cellulose based Nano-Bio-Composites
Hyun-Joong Kim
Kauffman Foundation Conference Center, United States of America
-
300.
Research Trend of Nano-Composie & Bio-Composites [Invited Speaker]
Hyun-Joong Kim
Yamaguchi University, Japan
-
299.
Non-Halogen System of Flame
Ji-Won Park
Yamaguchi University, Japan