접착과학 및 바이오복합재료 연구실

International Conference

Total Results : 427

  • 307. The Role of the Adhesive to Overcome the Bottleneck in the Electrical and Electronic Convergence Industry [Invited Speaker]
    Hyun-Joong Kim
    Material & Mathematics (January 29, 2015 ~ January 31, 2015 / Material & Mathematics)
    Shanghai, China
  • 306. EVA/Intumescent Agent Flame Retardant Composite Materials using Organic/Inorganic Hybrid Filler
    Ji-Won Park Hoon Kim Hyun-Joong Kim
    International Conference on Construction Materials and Structures (ICCMATS 2014) (November 24, 2014 ~ November 26, 2014 / International Conference on Construction Materials and Structures (ICCMATS 2014))
    Johannesburg, South Africa
  • 305. Challenge of New OCA for the Next Generation Display [Invited Speaker]
    Hyun-Joong Kim
    The 5th Conference of Asia Regional Adhesive Council (ARAC 2014) (October 29, 2014 ~ October 31, 2014 / The 5th Conference of Asia Regional Adhesive Council (ARAC 2014))
    Kobe International Conference Center, Japan
  • 304. Polymer Syntheis and Properties of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
    Seung-Woo Lee Tae-Hyung-Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Seung-Man Kim Jae-Hak Lee Jun-Yeob Song
    Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference (October 22, 2014 ~ October 24, 2014 / Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference)
    University of Tokyo, Japan
  • 303. Polymer Testing of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
    Seung-Woo Lee Tae-Hyung Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Sung-Hun Lee Seung-Man Kim Jae-Hak Lee
    Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference (October 22, 2014 ~ October 24, 2014 / Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference)
    University of Tokyo, Japan
  • 302. Design and Characterizations of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process
    Seung-Woo Lee Tae-Hyung Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim Sung-Hun Lee Seung-Man Kim Jae-Hak Lee
    Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference (October 22, 2014 ~ October 24, 2014 / Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference)
    University of Tokyo, Japan
  • 301. Application and Development of Nano-Cellulose based Nano-Bio-Composites
    Hyun-Joong Kim
    The 22nd Annual Meeting of the Bio-Environmental Polymer Society (BEPS 2014) (October 14, 2014 ~ October 17, 2014 / The 22nd Annual Meeting of the Bio-Environmental Polymer Society (BEPS 2014))
    Kauffman Foundation Conference Center, United States of America
  • 300. Research Trend of Nano-Composie & Bio-Composites [Invited Speaker]
    Hyun-Joong Kim
    International Workshop on Basis and Application of Woody Materials & Natural Fiber Composites (September 12, 2014 ~ September 12, 2014 / International Workshop on Basis and Application of Woody Materials & Natural Fiber Composites)
    Yamaguchi University, Japan
  • 299. Non-Halogen System of Flame
    Ji-Won Park
    International Workshop on Basis and Application of Woody Materials & Natural Fiber Composites (September 12, 2014 ~ September 12, 2014 / International Workshop on Basis and Application of Woody Materials & Natural Fiber Composites)
    Yamaguchi University, Japan
  • 298. New Biocomposites for Bioscrew in Bone Joint Desease
    Tae-Hyung Lee Ji-Won Park Hyun-Joong Kim
    International Workshop on Basis and Application of Woody Materials & Natural Fiber Composites (September 12, 2014 ~ September 12, 2014 / International Workshop on Basis and Application of Woody Materials & Natural Fiber Composites)
    Yamaguchi University, Japan
  • 297. Design and Characterization of Temporary Bonding and Debonding Adhesives for 3D Multichip Packaging Process
    Seung-Woo Lee Tae-Hyung Lee Ji-Won Park Cho-Hee Park Hyun-Joong Kim
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 296. Preparation of Cloud Point Resistant-adhesive and its Performance for Touch Screen Panel
    Hyun-Joong Kim Cho-Hee Park
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 295. Synthesis and adhesion performance of acrylic polymer/organoclay nanocomposite PSAs by in-situ photoinitiated polymerization
    Hoon Kim Ji-Won Park Cho-Hee Park Hyun-Joong Kim Seung-Han Shin
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 294. Thermal Properties of Acrylic Pressure Sensitive Adhesives with Micro-encapsulated Phase Change Material(PCM) and Single Wall Carbon Nanotubes(SWCNT)
    Seong-Ju Lee Ji-Won Park Seung-Woo Lee Hyun-Joong Kim Seung-Han Shin
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 293. The role of the adhesive to overcome the bottleneck in the electrical and electronic convergence industry [Invited Speaker]
    Hyun-Joong Kim
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 292. Research on Conductivity Change of Electrical Conductive Adhesives depends on Shrinkage
    Jong-Gyu Lee Ji-Won Park Peng Dou Hyun-Joong Kim Seung-Han Shin
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 291. Analysis of the Curing Behavior and Adhesion Properties of Thermal/UV Dual-curing System for Optically Clear Adhesives
    Tae-Hyung Lee Ji-Won Park Dong-Hyuk Lim Dou peng Hyun-Joong Kim Seung-Han Shin
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 290. Evaluation of Shrinkage at UV Curing Process by Comparing Between Numerical Approach and Experimental Methods
    Ji-Won Park Jong-Gyu Lee Young-Min Yoo Hyun-Joong Kim Seung-Han Shin
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 289. Study on adhesion properties of hot-melt pressure adhesive based on epoxidized styrene-isoprene-styrene(ESIS) copolymer for transdermal drug delivery systems(TDDS)
    Peng Dou Jue Cheng Junying Zhang Hyun-Joong Kim
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan
  • 288. Fabrication of Hybrid Optically Clear Adhesives with UV Cationic Curing for Improving Properties and Black Matrix Curing
    Ji-Won Park Young-Min Yoo Dong-Hyuk Lim Hyun-Joong Kim Seung-Han Shin
    5th World Congress on Adhesion and Related Phenomena (September 07, 2014 ~ September 11, 2014 / 5th World Congress on Adhesion and Related Phenomena)
    Nara Prefectural New Public Hall, Japan